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Two-dimensional materials could make electronic devices thinner and more flexible, but a new study shows that the variability of their mechanical properties represents a key barrier. (Photo: U.S. Army RDECOM, via Wikimedia Commons)

Mechanical testing will be key to making thinner, more flexible electronics: U of T Engineering study

Left to right: Tatiana Estevez (Permalution), Valerie Ajayi (MechE 2T1 + PEY), Kelly Chu (MechE 2T1 + PEY), Eva Liu (MechE 2T1 + PEY) in phone picture, Alyson Wong (MechE 2T1 + PEY) and Professor Markus Bussmann (Chair, MIE) stand next to a prototype fog harvester in the student arena within the Myhal Centre for Engineering Innovation & Entrepreneurship. (Photo submitted)

U of T Engineering students partner with startup to build fog harvesting apparatus

Loretta Rogers (Hon LLD 2018), speaking at U of T Convocation in 2018. (Photo: Lisa Sakulensky)

How the Rogers family built a legacy of innovation at U of T Engineering

mosquito in the dark on a vertical surface

Mosquito-repellent paint among five projects funded by CGEN seed grant program